: Engineers glue microscopic sensors called strain gages onto specific "high-risk" areas of the board, usually near large BGAs or mounting holes.
IPC/JEDEC-9704: The Standard Guide for PCB Strain Gage Testing ipc-9704 pdf
A medical device manufacturer was experiencing 4% field failures on handheld monitors (failed BGA joints). They downloaded an and implemented a strain gage test on their depanelization router. Demystifying IPC-9704: The Critical Standard for PCB Strain
(Let's stick to the most current and accurate industry definition) . Improved reliability and performance of PCBs Reduced risk
The primary goal is to provide a standardized methodology for so that results can be compared across different manufacturing sites and suppliers. This is critical for modern electronics because lead-free solders and thinner, denser boards are more prone to brittle fractures. Key Requirements & Specifications